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G-ænial™ Bond
Self-Etch, Seventh Generation Bonding Agent

Research

IADR 2011, G-ænial Bond: Bond Strengths

 

 

Physical Properties

 Shear Bond Strengths in Self-Etch mode:
 To Enamel  Over 31 MPa
 To Dentin  Over 27 MPa

 

 Application Time:
 30 seconds from application time to light-cure

 

 Bonding Layer Thickness:
 Less than 10 µM

 

 

 

Source: GCC R&D

NOTE: G-ænial™ Bond Unit Dose is NOT available in Canada at this time.




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